MCL-x25 Wafer Transfer Machine

MCL-x25 Wafer Transfer Machine

The MacLite Junior Series will transfer a maximum of 25 wafers between two cassettes, two process boats or one process boat and one cassette. As with all Mactronix wafer transfer systems, the MacLite Series may be configured to accommodate a wide range of Plastic, Teflon®, Metal, Quartz, Silicon Carbide, and Polysilicon carriers. Fast & Smooth, featuring ramped speeds. A 25 wafer transfer is under 40 seconds. Operator interface is with a 12 key keypad with a 4 line LCD display.


MacLite machines are totally electronic, with an auto switching power supply, 110 Vac 60 Hz or 240 Vac 50/60 Hz. The machine will not introduce more than 1.5 particles, greater than .23 micron in diameter, per wafer per transfer (machine must be exhausted to achieve this figure). Single Board PC controlled. Sensors detect wafers and cassette or process carrier presence for safety.

Options

  • Extended Platform
  • Vespel package for high temperature applications
  • Stainless steel covers
  • Hot Wafer/Boat Sensor

 

Enquire about this Product

Features

  • The MacLite Junior Series will transfer a maximum of 25 wafers between two cassettes, two process boats or one process boat and one cassette.
  • As with all Mactronix wafer transfer systems, the MacLite Series may be configured to accommodate a wide range of Plastic, Teflon®, Metal, Quartz, Silicon Carbide, and Polysilicon carriers.
  • Fast & Smooth, featuring ramped speeds. A 25 wafer transfer is under 40 seconds.
  • Operator interface is with a 12 key keypad with a 4 line LCD display.
  • MacLite machines are totally electronic, with an auto switching power supply, 110 Vac 60 Hz or 240 Vac 50/60 Hz.
  • The machine will not introduce more than 1.5 particles, greater than .23 micron in diameter, per wafer per transfer (machine must be exhausted to achieve this figure).
  • Single Board PC controlled.
  • Sensors detect wafers and cassette or process carrier presence for safety.
  • Flat alignment is maintained during transfer.
  • Machine will not drop wafers in the event of a power failure and will prompt the operator through the Recovery Mode after power has been restored.
  • All exposed aluminum parts are hard Black Anodized.
  • Covers are powder covered aircraft grade aluminum.
  • A “Technician Mode” is provided to facilitate preventative maintenance.​

 

Specifications

Power220/110VAC 50/60Hz Single Phase 3 Amp @ 110VAC
GroundingSingle Point Low Impedance VAC (provided)
Exhaust1.25″ Diameter port; 5 CFM max. (non-process)
Wafer size3" (75mm) - 8" (200mm)
Weight50 Lbs
Dimensions75mm thru 150mm (3″ thru 6″): 8″ x 14″ x 32″
200mm (8 inch): 10″ x 14.5″ x 32.5″
NOTE: Optional Extended Platform will add ≈ 6″ to the overall width of the machine.

 

This site uses cookies. By continuing your visit, you accept their use as set out in our Cookie Policy. Accept All CookiesCookie Preferences