The UV/Ozone cleaning process provides a simple, inexpensive, and fast method of obtaining ultra-clean surfaces free of organic contaminants on most inorganic substrates, such as quartz, silicon, gold, nickel, aluminium, gallium arsenide, alumina, etc. The process is ideal when thin film deposition with excellent adhesion to the substrate is required. Ultra-clean surfaces can easily be achieved by UV/Ozone processing in one to several minutes after the substrate has been cleaned by conventional techniques.
- Ultra clean surfaces
- Room temperature process
- Fast - less than ten minutes for many applications
- Easy Processing
- Modest initial price and minimal operating cost
UV/Ozone Cleaning Removes Traces of:
- Skin oil,
- Silicone Oil
- Solder Flux
- Residual Photoresist
- Condensed Adhesive Volatiles
- Carbon Traces.
How Clean is "ultra" clean?
Contact angle measurements of 4-5 degrees. Miniscule peaks when measured with AES and ESCA. With steam test, there are uniform rainbow-like fringes during condensation and evaporation. Often, cleaning of critical surfaces prior to other processing steps is considered finished after the usual scrubbing and ultrasoneration steps. Ultra-violet/ozone cleaning adds a new dimension to cleaning... a valuable new dimension that can prove itself in dollars and cents in improved performance and reliability in applications where UV/Ozone can be used after the standard cleaning operation.