ML2-x25 Wafer Transfer Machine

ML2-x25 Wafer Transfer Machine

The MacLite Junior 2-Stage Series will transfer a maximum of 25 wafers between two cassettes, two process boats or one process boat and one cassette. As with all Mactronix wafer transfer systems, the MacLite Series may be configured to accommodate a wide range of Plastic, Teflon®, Metal, Quartz, Silicon Carbide, and Polysilicon carriers. Fast & Smooth automatic transfer, featuring ramped elevator and platform speeds.

One transfer cycle takes less than 45 seconds. Operator interface is with a 12 key keypad and a 4 line LCD display. Stage shifts left and right for safe and easy loading/unloading of cassettes and boats. MacLite machines are completely electronic, with an auto switching power supply to accommodate 110 VAC 60 Hz or 240 VAC 50/60 Hz. Clean operation introduces less than 1.5 particles that are less than .25 micron in diameter, per wafers per transfer. Single Board PC controlled. Sensors detect wafers and cassette or process carrier presence for safety.

 

 

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Features

  • The MacLite Junior 2-Stage Series will transfer a maximum of 25 wafers between two cassettes, two process boats or one process boat and one cassette.
  • As with all Mactronix wafer transfer systems, the MacLite Series may be configured to accommodate a wide range of Plastic, Teflon®, Metal, Quartz, Silicon Carbide, and Polysilicon carriers.
  • Fast & Smooth automatic transfer, featuring ramped elevator and platform speeds. One transfer cycle takes less than 45 seconds.
  • Operator interface is with a 12 key keypad and a 4 line LCD display.
  • Stage shifts left and right for safe and easy loading/unloading of cassettes and boats.
  • MacLite machines are completely electronic, with an auto switching power supply to accomodate 110 VAC 60 Hz or 240 VAC 50/60 Hz.
  • Clean operation introduces less than 1.5 particles that are less than .25 micron in diameter, per wafers per transfer.
  • Single Board PC controlled.
  • Sensors detect wafers and cassette or process carrier presence for safety.
  • Flat/Notch alignment is maintained during transfer.
  • Machine will not drop wafers in the event of a power failure and will prompt the operator through the Recovery Mode after power has been restored.
  • Pressure sensors are used on the lift system and platform to prevent both personnel and wafer damage during transfer.
  • All exposed aluminum parts are Anodized for corrosion protection.
  • Covers are powder-coated aircraft grade aluminum.
  • All bearings are cleanroom rated.
  • A “Technician Mode” is provided to facilitate preventative maintenance.​

Specifications

Power110/220V, 50/60Hz Single Phase 3 Amp @ 110VAC
GroundingSingle Point Low Impedance VAC (provided)
Exhaust1.25″ Diameter port; 5 CFM max (non-process)
Wafer size3" (75mm) - 8" (200mm)
Weight70 Lbs
Dimensions432mm (17") x 610mm (24") x 1,194mm (47")

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